TOKYO (Reuters) -Japan’s $550 billion investment package agreed in this week’s U.S. tariff deal could help finance a Taiwanese firm building semiconductor plants in the U.S., Japan’s top trade negotiator Ryosei Akazawa said on Saturday. Japan agreed to the sweeping U.S.-bound investment initiative, which includes equity, loans and guarantees, in exchange for lower tariffs on its exports to the U.S. “Japan, the United States, and like-minded countries are working together to build supply chains in sectors critical to economic security,” Akazawa told public broadcaster NHK.
Japan says $550 billion package in trade deal could finance Taiwanese chipmaker in US
